F142 異方性熱伝導材料の熱抵抗計測(電子機器冷却をリードする我が国の先進技術と展望IV)

概要

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In this research, thermal resistance of the anisotropic thermal conductivity material was measured. For applying the local cooling technique by using spray cooling for semiconductor devices, splayed liquid should not be directly flowed to the surface of semiconductor devices. Then some solid materials are required between liquid and semiconductor devices. From the view point of reduction of thermal resistance with solid, super thermal conductivity material is attractive and we chose a block of STC. STC also has anisotropic thermal conductivity. As a result, thermal conductance for the good thermal conductive direction shows 5-6 times larger than that for other directions and thermal resistance for the good thermal conductive direction is 0.1 K/W.
2009-11-06