垂直チャネル電子機器モデル内の自然対流速度に対する壁面加熱条件の影響

概要

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Natural convective flow field and cooling capability in compact electronic equipment have been investigated. Temperature and velocity measurements were carried out using a channel model of electronic equipment. The channel model having a vertical duct with rectangular section was used as experimental model. The channel model has two copper walls simulating the printed circuit boards and two transparent acrylic walls simulating the case walls. The clearance between the copper walls and the wall surface heating conditions were taken as parameters of channel model. The clearance between the copper walls was varied from 5mm to 15 mm. The experiments were conducted at three different thermal conditions: symmetric heating, asymmetric heating and one-sided heating. Velocity profiles of natural cooling flow in the channel were quantitatively measured using a particle image velocimetry (PIV). From the results, it is clarified that the changes in the velocity profiles strongly depend on the thermal conditions.
社団法人日本伝熱学会の論文
2009-07-01