J0103-4-3 薄型筐体内に設置した基板上の強制対流冷却性能(電子情報機器,電子デバイスの強度・信頼性評価と熱制御(4))

概要

論文の詳細を見る
This paper describes air cooling performance for electronic circuit boards set in the thin enclosure, where cooling air flow pass is very narrowed by many mounted devices. Especially, we focused on the effects of various heat dissipation values from chips and the space on the board. To discuss the cooling performance in the thin enclosure, we designed a test enclosure model which is composed of a model cardboard including 5 heat sources and a heatsink duct and inspected a temperature rise of the model board and heat sources experimentally. From the result, it is found that we obtained a similar cooling performance regardless of different heat dissipation values and heat dissipation locations when we have the high thermal conductivity electronic boards and a heatsink on the board to dissipate the heat, even with narrow cooling flow pass on the board.
2009-09-12