J0601-2-5 熱回路網を用いた薄型電子機器モデル内部の熱解析([J0601-2]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(2))

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This paper describes a thermal network analysis of an electronic circuit board set in the thin enclosure, where cooling air flow pass is very narrowed by many mounted devices. We focused on the prediction accuracy of the temperature distribution on the board by using the thermal network method. Especially, we discuss the accuracy temperature rise distribution of the board depending on cooling performance of a heatsink. In order to discuss the cooling performance in the thin enclosure, we designed a test enclosure model which is composed of a model cardboard including 5 heat sources and a heatsink duct. Then, we developed the thermal network model for the calculation of the temperature field on the board in the thin enclosure. We obtained a thermal resistance of the heat sink experimentally, and incorporated it into the thermal network method as the heat sink performance. As a result, we can obtain a good agreement between the experimental results and the calculated results for temperature rise distribution on the board. In addition, it is found that we can predict the temperature field on the board with the higher accuracy when the thermal resistance value from the heat sink could be given.
2010-09-04