F132 軸流空冷ファンによる局所強制対流冷却電子機器の冷却性能(電子機器冷却をリードする我が国の先進技術と展望III)

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This paper describes air cooling performance which is driven by axial cooling fans for electronic circuit boards set in the thin enclosure, where cooling air flow pass is very narrowed by many mounted devices. Especially, we focused on an effect of a flow pattern difference between the fan flow, which is a rotational flow, and the uniform stream. To discuss the effects of the fan flow to the heat transfer performance, we designed a test enclosure model which is composed of a model cardboard including 5 heat sources and a heatsink duct including the axial fan and inspected a temperature rise of the model board and heat sources. From the result, it is found that the effect of the fan's three-dimensional flow may affect the heat transfer performance.
2009-11-06