J0601-2-3 層間接続バンプを含むプリント基板の熱回路網法による放熱性能評価手法([J0601-2]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(2))

概要

論文の詳細を見る
This paper describes the evaluation of heat dissipating performance of printed circuit boards (PCBs) with bump interconnections. We used buried bump interconnection technology (B^2it) PCBs with or without copper on the surface of PCB and measured its thermal resistance. The experimental results showed that the thermal resistances of B^2it PCBs were decreased with larger bump area. And thermal resistance difference between the case with and without copper can be shown. Further, we discussed the modeling domain of B^2it PCBs by using thermal network method. As a result, the calculated thermal resistances were dependent on modeling domains.
2010-09-04