B234 シリコーングリースの熱伝導率の簡易測定に関する基礎研究(エレクトロニクス機器・デバイスのサーマルマネージメント2)

概要

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To attain high cooling performance in the electronic equipment like personal computers with high heat fluxes, an interstitial material (generally, some kind of grease) is often introduced between a heat sink and a heat source. Concerning this problem, the authors have been conducting basic experiments. However, in those experiments, there have been observed fairly large differences between the measured thermal resistances and those estimated by using the grease thickness and the thermal conductivity put on a catalogue. Then, in the present study, a simple method for thermal conductivity measurement of a grease has been tried, where the thickness of the grease layer has been changed from about 0.75, 1.75 and to 2.70mm.
社団法人日本機械学会の論文
2006-11-23