自然換気型電子機器筺体の熱設計手法の研究(発熱密度の異なる鉛直平行基板群を有する筐体内の自然対流熱伝達特性)(熱工学, 内燃機関, 動力など)

概要

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An increasing demand for high reliability of electronic equipment requires free convection cooling of electronic components on printed wired boards (PWBs). The electronic components on the PWBs are cooled with natural ventilation by air flow and the temperature rise of the ventilated air between PWBs must be accurately predicted. These subjects make the thermal design difficult for equipment designers, and the thermal optimization method using design knowledge and numerical analysis model before making proto-type are needed. In this paper, the thermal phenomenon in a model enclosure which had 16 parallel vertical smooth flat plates with heaters was studied experimentally. It was shown that the ventilated flow rate in one section was found to be affected by the heat loads in other sections. And the predicted temperature rise with Computational Fluid Dynamics model was in good agreement with the experimental results.
社団法人日本機械学会の論文
2002-05-25