1117 電子機器の強制空冷下での多孔性金属板障害物の影響 : 孔列数の効果(J08-3 電子情報機器,電子デバイスの強度・信頼性評価と熱制御(3) 基板・部品の特性評価,ジョイントセッション,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

概要

論文の詳細を見る
Two rectangular block-like elements as an electronic module are positioned in a parallel-walled channel and cooled by forced convection airflow. A metal plate with holes as a barrier protrudes above the plane of the modules, which is intended to function as a cover for protecting them from mechanical or electromagnetic damage. Per-module heat transfer coefficients were measured by varying the row numbers of holes of the barrier, and compared to those of the barrier without holes. The row number of the holes of the barrier influences the heat transfer performance to classify into enhancement and reduction zones.
一般社団法人日本機械学会の論文
2008-08-02