J0103-4-5 電子機器の強制空冷下での流路を閉塞する多孔性金属板障害物の影響(電子情報機器,電子デバイスの強度・信頼性評価と熱制御(4))

概要

論文の詳細を見る
Two rectangular block-like elements as an electronic module are positioned in a parallel-walled channel and cooled by forced convection airflow. A metal plate with holes as a barrier blocks the channel, which is intended to function as a cover for protecting them from mechanical or electromagnetic damage, or as a thermal control device. Per-module heat transfer coefficients in the presence of the barrier of various hole diameter d, porosity, and distance L, between the module and the barrier were measured. In the presence of the barrier with holes, the heat transfer coefficient at two modules was improved. Nusselt numbers are correlated as a function of Reynolds number, L/d and porosity.
一般社団法人日本機械学会の論文
2009-09-12