1914 電子機器の強制空冷下での孔無し金属板障害物の影響(J16-1 電子情報機器,電子デバイスの熱制御と強度・信頼性評価(1),J16 電子情報機器,電子デバイスの熱制御と強度・信頼性評価)

概要

論文の詳細を見る
Two rectangular block-like elements as an electronic module are positioned in a parallel-walled channel and cooled by forced convection airflow. A metal plate without holes as a barrier protrudes above the plane of the modules, which is intended to function as a cover for protecting them from electromagnetic damage or as a thermal control device. Per-module heat transfer coefficients in the presence of barriers of various height and distance between the module and the barrier were measured. In the presence of the barrier, the heat transfer coefficient at the 2^<nd> row module is enhanced, but is diminished at the 1^<st> row module. Nusselt numbers are correlated as a function of Reynolds number.
一般社団法人日本機械学会の論文
2007-09-07