Ultrasonic Flaw Detection for High Impedance Materials Using a Transmission Line Coupling Method
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1997-05-30
著者
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YAGI Shuhei
Department of Physical Electronics, Tokyo Institute of Technology
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Tagawa N
Tokyo Metropolitan Univ. Tokyo Jpn
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Tagawa Norio
Department Of Electrical Engineering Tokyo Metropolitan University
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Yagi S
Department Of Physical Electronics Tokyo Institute Of Technology
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Tagawa Norio
Tokyo Metropolitan Univ.
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Moriya Tadashi
Tokyo Metropolitan Univ.
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Yagi Syuhei
Department Of Physical Electronics Tokyo Institute Of Technology
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Moriya T
Institute Of Material Science University Of Tsukuba
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MORIYA Tadashi
Department of Electrical Engineering, Tokyo Metropolitan University
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YOSHIZAWA Masasumi
Department of Electrical Engineering, Tokyo Metropolitan University
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YAGI Shin-ichi
Department of Electronics and Computer Science, Meisei University
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Moriya Tadashi
Department Of Electrical Engineering Tokyo Metropolitan University
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Moriya Tsuyoshi
Institute Of Material Science University Of Tsukuba
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Moriya T
Tokyo Metropolitan University Graduate School Of Engineering
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YAMAGUCHI Hirokuni
Department of Electrical Engineering, Tokyo Metropolitan University
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TOYAMA Masaharu
Toshiba Research and Development Center
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Tagawa Norio
Depart. Of Mechanical Engineering High Technology Research Center Kansai University
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Moriya T
Graduate School Of Engineering Tokyo Metropolitan University
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Yagi S
Meisei Univ. Tokyo Jpn
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Yoshizawa M
Tokyo Metropolitan Technical College
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Yagi Shin-ichi
Department Of Electrical & Electronics Engineering College Of Science & Technology Sophia Un
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Yamaguchi Hirokuni
Department Of Electrical Engineering Tokyo Metropolitan University
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