E214 熱伝導解析によるBGAパッケージの温度予測(オーガナイズドセッション21 : 電子機器の熱設計と解析の応用)

概要

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In this paper is presented a method of predicting thermal resistance of EGA package on the basis of a simple thermal conduction analysis. To cope up with the strong competition of personal computer market, new models need to be designed and developed within a very short time period. Therefore, it is very much essential to develop a cost effective engineering tool to predict thermal resistance of package under complex and adverse packaging conditions. In this method of thermal analysis, specifying physics-based boundary condition is very important. Otherwise, the time required for the simulation and the error caused by physically improper boundary conditions may lead to serious problem. In the present work a parameter survey is carried out to study the effect of different parameters on the result of calculations. This study helped to find out the proper boundary conditions, which could be used in the thermal conduction analysis to predict the thermal resistance with high accuracy. This engineering method also contributed to the development of electronic equipment within a very short time period.
社団法人日本機械学会の論文
2001-11-03