小形きょう体の熱解析 : 第2報, ファン付きポータブルPCの熱解析

概要

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This paper describes conduction model based numerical simulation technique for portable computers. A numerical analysis was carried out on the basis of thermal conduction treatment for the whole domain of a subnotebook computer which has a cooling fan. In this work, thermal conduction analysis was employed to estimate the temperature distribution of a computer. To treat the airflow caused by the cooling fan, a lump model was used in addition to the thermal conduction model. The numerical model includes silicon chips, LSI packages, printed wiring boards, enclosure, etc., and excludes the liquid crystal display portion. Temperature rise of LSI packages obtained by the numerical analysis showed a good agreement with measured values, and this indicates the effectiveness of the present analysis method for the design of portable computers.
社団法人日本機械学会の論文
1998-12-25