銅単結晶の超精密切削における加工変質層の結晶学的解析

概要

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Diamond turning of single-crystal copper was carried out in several crystallographic orientations at a depth of cut of 300 nm. Transmission electron microscope observation and Laue X-ray analysis revealed that surface damage depends strongly on the crystallographic orientations of the copper, although turned surface features and continuous chip morphologies are independent. When turning is carried out along the [110] slip direction on the (111) slip plane, plastic deformation in the turned surface layer occurs mainly on the (111) planes parallel to the surface, and thus a fault in the stacking of the (111) planes occurs due to slip deformation. Surface layer crystals turned along arbitrary directions, except for the case of the slip direction on the slip plane, rotate towards the cutting direction, and the surface structure changes to a polycrystal composed of long narrow crystals. The longitudinal direction of each crystal is related to the slip direction rather than the cutting direction. When turning is carried out along the slip direction, as in the case of turning along the [110] direction on the (110) plane, the longitudinal direction of the crystals coincides with the cutting direction.
公益社団法人精密工学会の論文
1995-11-05