薄膜の非破壊的付着強度評価法

概要

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We propose a method for evaluating the adhesive force of thin films. The back surface of a thin film is pressurized by gas through a small hole which penetrates its substrate. It is then peeled by a uniformly distributed load attributable to this gas pressure. The adhesive force of the thin film to its substrate is defined as the gas pressure, and peeling is detected with an acoustic emission (AE) sensor. The adhesion of diamond thin films deposited by filament-assisted CVD to a silicon substrate was measured using this method. The diamond thin film was peeled from the substrate without fracturing the film, and the measured adhesive forces were found to be independent of the film thickness. The AE signals caused by film peeling were distinguishable from those caused by a film fracture. These results confirm that this method can be used to measure the actual adhesive force without causing the thin film to fracture.