ポリシングパッドの粘弾性とポリシング機構の解析

概要

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The purpose of this study is to analyze the thickness deviation conditioning effect of the polishing by a polishing pad. The quartz crystal unit that oscillates directly with more than 100MHZ requires the polishing of thickness less than 17 цm and the thickness deviation 0.3 цm (a wafer) within. The working became possible with the composite plate that attached quartz wafer (a diameter 76mm) and a standard plate. However, it is difficult to do wide area a highly precise polishing. The action of a polishing pad is important to grasp the dynamic behavior of polishing pad that is able to reproduce the condition of polishing. It became possible with 4 elements of Burger s model of a visco-elasticity. The thickness deviation conditioning effect that calculated it from the dynamic character and vibration analysis confirmed the appropriateness from the comparison with an experiment value.
公益社団法人精密工学会の論文
1999-02-05