Damage-Free Flattening Technology of Large Scale Si Wafer Employing Localized SF6/H2 Downstream Plasma
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概要
- 論文の詳細を見る
- 1999-09-20
著者
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YANAGISAWA Michihiko
Speedfam Co., Ltd.
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Iida S
Toyama Univ. Toyama Jpn
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Iida Shinya
Speedfam Co. Ltd.
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Horiike Yasuhiro
National Inst. For Materials Sci. Ibaraki Jpn
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Horiike Yasuhiro
Biomaterials Center National Institute For Materials Science
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OGAWA Hiroki
Development of Material Science, School of Engineering, University of Tokyo
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HORIIKE Yasuhiro
Development of Material Science, School of Engineering, University of Tokyo
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Yanagisawa Michihiko
Speedfam Co. Ltd.
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Ogawa Hiroki
Development Of Material Science School Of Engineering University Of Tokyo
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Yanagisawa Michihiko
Speedfam-ipec Co. Ltd.
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Iida Shinya
Speedfam-ipec Co. Ltd.
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Horiike Yasuhiro
Development Of Material Science School Of Engineering University Of Tokyo
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Horiike Yasuhiro
World Premier International (wpi) Research Center Initiative International Center For Materials Nano
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- PREFACE
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- Fabrication and Characterization of Quartz Nanopillars for DNA Separation by Size