In Vivo Batteryless Wireless Communication System for Bio-MEMS Sensors
スポンサーリンク
概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2005-04-30
著者
-
Masu Kazuya
Precision And Intelligence Laboratory Tokyo Institute Of Technology
-
OKADA Kenichi
Precision and Intelligence Laboratory, Tokyo Institute of Technology
-
Horiike Yasuhiro
Biomaterials Center National Institute For Materials Science
-
Yamada Tomohiro
Precision And Intelligence Laboratory Tokyo Institute Of Technology
-
Oki Akio
Biomaterials Center National Institute For Materials Science
-
UEZONO Takumi
Precision and Intelligence Laboratory, Tokyo Institute of Technology
関連論文
- Variable RF Inductor on Si CMOS Chip
- Floating Potential in Negative-Ion-Containing Plasma
- A Study on Mechanism of Chemical Mechanical Polishing on Al and Cu Surfaces Employing In-situ Infrared Spectroscopy
- In-Situ Observation of Oxygen Exposed Hydrogen Terminated Silicon Surfaces
- Selective Processing of Individual Carbon-Nanotubes Using Atomic Force Microscopy Installed in Transmission Electron Microscope
- Sheath Width in Negative-Ion-Containing Plasma
- Emissive Probe Study of CF_4/H_2 Etching Plasma
- Improvement of Variable Ratio of On-Chip Variable Inductors Using Side Shield
- A Large Variable Ratio On-Chip Inductor with Spider Legs Shield
- Small-Area Inductor for Silicon CMOS Chips
- Wide Tuning Range LC-VCO Using Variable Inductor for Reconfigurable RF Circuit(Analog Circuit Techniques and Related Topics)
- Small Area Snake Inductor on Si RF CMOS Chip
- On-chip Spiral Inductors Integrated with Wafer-Level Package
- Integrated DNA Purification and Detection Device for Diagnosis of Infection Diseases
- DNA Size Separation Employing Quartz Nano-Pillars with Different Allocations
- Zero-Crosstalk Bus Line Structure for Global Interconnects in Si ULSI
- Twisted Differential Transmission Line Structure for Global Interconnect in Si LSI
- High-Speed Transmission Circuit for Micro Network on Si ULSI
- Twisted Differential Transmission Line Structure for EMI Noise Reduction at Global Interconnect in Si LSI
- RF Attenuation Characteristics for In Vivo Wireless Healthcare Chip
- Optimization Technique of Number of Interconnect Layers and Circuit Area Based on Wire Length Distribution
- in-vivo Wireless Communication System for Bio MEMS Sensors
- GHz Clock Distribution Using Transmission Line Interconnect and CMOS Differential Driver Circuit in Si ULSI
- Interconnect Length Distribution in Si System ULSI
- One-Chip Integration of the Rapid Diagnosis Infectious Disease Chip Based on New Phenomena of DNA Trap and Denature in Nano-Gaps
- In Vivo Batteryless Wireless Communication System for Bio-MEMS Sensors
- Damage-Free Flattening Technology of Large Scale Si Wafer Employing Localized SF6/H2 Downstream Plasma
- Reactive Ion Beam Etching of SiO_2 and Poly-Si Employing C_2F_6, SiF_4 and BF_3 Gases
- Grafting Poly(ethylene glycol) to a Glass Surface via a Photocleavable Linker for Light-induced Cell Micropatterning and Cell Proliferation Control
- KrF Excimer Laser Projection Lithography: 0.35μm Minimum Space VLSI Pattern Fabrication by a Tri-Level Resist Process
- Small-Area Inductor for Silicon CMOS Chips
- Droplet device for immunoassay detection
- Si and SiO_2 Etching Characteristics Using Reactive Ion Etching with CF_4-Cl_2 Gas Mixture
- A Portable Biochemical Analysis System Integrated with Microcapillary Electrophoresis and Microplasma Emission Spectroscopy
- PREFACE
- Application of Photoexcited Reaction to VLSI Process (Special Issue on Opto-Electronics and LSI)
- Si and SiO_2 Etching Characteristics by Fluorocarbon Ion Beam
- Equivalent Circuit Analysis of RF-Integrated Inductors with/without Ferromagnetic Material
- Variable RF Inductor on Si CMOS Chip
- On-Chip Variable Inductor Using Microelectromechanical Systems Technology
- In Vivo Batteryless Wireless Communication System for Bio-MEMS Sensors
- Improvement of Variable Ratio of On-Chip Variable Inductors Using Side Shield
- Twisted Differential Transmission Line Structure for Global Interconnect in Si LSI