Jung Seung-boo | School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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概要
関連著者
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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JUNG Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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Jung Seung‐boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jung Seung-boo
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Lee Jong-bum
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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YEON Yun-Mo
Department of Advanced Materials Application, Suwon Science College
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Lee Jong-Bum
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jung Seung-Boo
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Choi Don-hyun
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Jung Seung-boo
School Of Advanced Materials Sci. And Engineering Sungkyunkwan Univ.
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Yeon Yun-mo
Department Of Advanced Materials Application Suwon Science College
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CHOI Don-Hyun
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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LEE Chang-Yong
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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AHN Byung-Wook
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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Koo Ja-Myeong
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Lee Jong-Gun
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Jung Seung‐boo
Sungkyunkwan Univ. Suwon Kor
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Koo Ja-myeong
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Koo Ja-myeong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Lee Chang-yong
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Ahn Byung-wook
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Kim Jong-woong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea
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SONG Keun
Department of Advanced Materials Application, Suwon Science College
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Jo Jung-Lae
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Yoon Jeong-won
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Song Keun
Department Of Advanced Materials Application Suwon Science College
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Noh Bo-in
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Jo Jung-lae
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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BAEK Seung-Wook
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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LEE Chang-Yong
Automotive Applications Research Team, Technical Research Center, Hyundai Steel
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YOON Jeong-Won
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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Moon Jeong-Hoon
Suwon Sci. College, Dept. of Mechanical Eng.
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Jung S‐b
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Jung Seung-boo
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Baek Seung-wook
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Moon Jeong‐hoon
Suwon Sci. College Dept. Of Mechanical Eng.
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Koh Min-kwan
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-Gun
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Kim Dae-gon
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Moon Jeong-hoon
Suwon Sci. College Dept. Of Mechanical Eng.
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Jung Seung‐boo
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Moon Jeong-Hoon
Department of Mechanical Engineering, Suwon Science College, Hwaseong, Gyeonggi 440-746, Republic of Korea
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Yoo Choong-Don
Department of Mechanical Engineering, KAIST, Daejon, 305-701 Republic of Korea
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NOH Bo-In
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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CHOI Jung-Hyun
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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HA Sang-Su
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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YANG Jun-Mo
National Nanofab Center, Measurement & Analysis
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Ha Sang-su
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Yoon Jeong-won
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Moon Young‐jun
Samsung Electronics Co. Ltd. Suwon Kor
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Lee C‐b
Department Of Advanced Materials Engineering Sungkyunkwan University
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Kim Yu‐na
Sungkyunkwan Univ. Gyeonggi Kor
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Moon Won-chul
Sungkyunkwan Univ. Micro Electronic Packaging Consortium
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Shin Y‐e
Chung‐ang Univ. Seoul Kor
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Lee W‐b
Joining Research Group Technical Research Laboratories
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LEE Won-Bae
Joining Research Group, Technical Research Laboratories
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PARK Sun-Kyu
School of Civil and Environmental Engineering, Sungkyunkwan University
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Kim Kyung-sik
International Display Solution Co. Ltd.
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Nam Jae-do
School Of Applied Chemistry Sungkyunkwan University
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Yoon Jae-hyun
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Koh Min-Kwan
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Shin Young-eui
School Of Mechanical Engineering Chung-ang University
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Yang Jun-mo
National Nanofab Center Measurement & Analysis
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Yang Jun-mo
National Nanofab Center
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Hong Soon-Min
Samsung Electronics Co. Ltd.
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Shin Hyoyoung
Samsung Electronics Co. Ltd.
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Moon Young-jun
Samsung Electronics Co. Ltd.
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Kim Yu-Na
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Shin Young-eui
Department Of Mechanical Engineering Chungang University
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Choi Jung-hyun
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Shin Young-eui
Department Of Mechanical Engineering Chung-ang University
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Jeon Sung-ho
School Of Mechanical Engineering Chung-ang University
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Park Sun-kyu
School Of Civil And Environmental Engineering Sungkyunkwan University
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Ko Min-Kwan
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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SHUR Chang-Chae
Department of Advanced Materials Engineering, Sungkyunkwan University
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LEE Chang-Bae
School of Metallurgical and Materials Engineering, SungKyunKwan University
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SHUR Chang-Chae
School of Metallurgical and Materials Engineering, SungKyunKwan University
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KIM Dae-Gon
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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CHOI Sunglak
AMLCD Division, Samsung Electronics Co., Ltd.
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LEE Hoo-Jeong
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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JOO Jinho
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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Joo Jinho
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Choi Sunglak
Amlcd Division Samsung Electronics Co. Ltd.
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Lee Hoo-jeong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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KIM Dae-Gon
Advanced Materials and Process Research Center for IT, Sungkyunkwan University
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YOON Jeong-Won
Advanced Materials and Process Research Center for IT, Sungkyunkwan University
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LEE Chang-Youl
Advanced Materials and Process Research Center for IT, Sungkyunkwan University
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JUNG Seung-Boo
Advanced Materials and Process Research Center for IT, Sungkyunkwan University
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Kim Yu-na
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Lee Hoo-jeong
School Of Advanced Material Science Sungkyunkwan University
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Nah Wansoo
School Of Electrical And Computer Engineering Sungkyunkwan University
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Park Jongwoo
Quality & Reliability Team Samsung Electronics Co. Ltd.
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Lee Chang-youl
Advanced Materials And Process Research Center For It Sungkyunkwan University
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Shur Chang-chae
Department Of Advanced Materials Engineering Sungkyunkwan University
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Ha Sang-su
Quality & Reliability Team Samsung Electronics Co. Ltd.
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Ko Jae-hoon
School Of Electrical And Computer Engineering Sungkyunkwan University
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Park Sun-kyu
School Of Civil And Environmental Engineering Sungkyunkwan Univ.
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Jung Jae-Pil
Department of Materials Science & Engineering, University of Seoul
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Kim Jong-Min
School of Chemical Engineering & Material Science, Chung-Ang University
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Lee Jong-Gun
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Koo Ja-Myeong
Mechatronics and Manufacturing Technology Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Chun Chang-Keun
Welding Research Center, Research Institute of Industrial Science and Technology, Pohang, Gyeongbuk 790-330, Republic of Korea
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Lee Jong-Bum
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Lee Jong-Bum
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Lee Jong-Bum
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Kim Jong-Min
School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea
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Moon Jeong-Hoon
Department of Mechanical Engineering, Suwon Science College, Hwaseong, Gyeonggi-do 440-746, Republic of Korea
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Moon Young-jun
Fundamental Technology Research Team, Mechatronics and Manufacturing Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Koo Ja-Myeong
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Koo Ja-Myeong
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea
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Koo Ja-Myeong
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Kim Yu-Na
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Kim Dae-Up
Materials Research Department, Hyundai MOBIS Co., Yongin, Gyeonggi 446-912, Republic of Korea
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Hong Soon-Min
Fundamental Technology Research Team, Mechatronics and Manufacturing Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Shin Hyoyoung
Fundamental Technology Research Team, Mechatronics and Manufacturing Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Yoo Choong-Don
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 305-701, Republic of Korea
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Ha Sang-Su
Quality & Reliability Team, Samsung Electronics Co., Ltd.
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Noh Bo-In
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Noh Bo-In
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea
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Shin Young-Eui
School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Kim Jong-Woong
School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, Korea
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Kim Jong-Woong
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Jung Jae-Pil
Department of Materials Science and Engineering, The University of Seoul, Seoul 130-743, Republic of Korea
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Lee Young-Chul
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Korea
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Kim Yongil
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Korea
著作論文
- 2P4-2 超音波によるプリント基板接合における機械特性への表面仕上げの影響(ポスターセッション)
- Microstructure and Mechanical Properties of Friction Stir Spot Welded Galvanized Steel
- Structure-Properties Relations in Friction Stir Spot Welded Low Carbon Steel Sheets for Light Weight Automobile Body
- Effect of Cr Thickness on Adhesion Strength of Cu/Cr/Polyimide Flexible Copper Clad Laminate Fabricated by Roll-to-Roll Process
- 1P1-11 大気圧プラズマ処理の超音波バンプボンディングにおよぼす影響(ポスターセッション)
- Effect of Pin Shapes on Joint Characteristics of Friction Stir Spot Welded AA5J32 Sheet
- Electromigration Behavior of through-Si-via (TSV) Interconnect for 3-D Flip Chip Packaging
- 1Pb-49 超音波接合されたフリップチップパッケージにおける非鉛エポキシソルダの熱特性(ポスターセッション)
- 1Pb-50 金属基板とフレキシブル基板の超音波接合特性(ポスターセッション)
- Microstructures and Mechanical Properties of Double-Friction Stir Welded 2219 Al Alloy
- 1P1-12 フレキシブル電極パターンのガラス基板上への超音波ボンディングと諸条件の影響(ポスターセッション)
- 2-09P-48 プリント基板をフレキシブル基板間の接合強度に及ぼす溶接条件の影響(ポスターセッション 2)
- 2-09-03 超音波ボンディングされたフリップチップバンプとフレキシブル基板の接合強度への大気圧プラズマの影響(強力超音波)
- The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
- Characterization of Failure Behaviors in Anisotropic Conductive Interconnection
- Reaction Diffusion and Formation of Cu_In_9 and In_Ni_ Phases in the Couple of Indium-Substrates
- Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics
- Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate
- Transmission property of flip chip package with adhesive interconnection for high frequency applications
- Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint
- Application of Underfill for Flip-Chip Package Using Ultrasonic Bonding
- Effect of Time and Pressure on Ultrasonic Bonding Strength of Flexible Printed Circuit Board to Glass with Nonconductive Film
- Electrical Characterization of Screen-Printed Conductive Circuit with Silver Nanopaste
- Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards
- Effect of Sintering Temperature on Electrical Properties of Chip on Glass Module with Direct Printing Method (Special Issue : Advanced Electromaterials)
- Microstructures and Mechanical Properties of Friction Stir Welded 2.25Cr-1Mo Steel