Lee Jong-bum | Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
スポンサーリンク
概要
関連著者
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Lee Jong-bum
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jung Seung‐boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-Bum
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jung Seung-Boo
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Koo Ja-Myeong
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jung Seung‐boo
Sungkyunkwan Univ. Suwon Kor
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Koo Ja-myeong
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Jo Jung-Lae
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jo Jung-lae
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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JUNG Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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Moon Jeong-Hoon
Suwon Sci. College, Dept. of Mechanical Eng.
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Lee Jong-Gun
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Moon Jeong‐hoon
Suwon Sci. College Dept. Of Mechanical Eng.
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Koh Min-kwan
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-Gun
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Moon Jeong-hoon
Suwon Sci. College Dept. Of Mechanical Eng.
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Moon Young‐jun
Samsung Electronics Co. Ltd. Suwon Kor
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Kim Yu‐na
Sungkyunkwan Univ. Gyeonggi Kor
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Moon Won-chul
Sungkyunkwan Univ. Micro Electronic Packaging Consortium
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Yoon Jae-hyun
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Koh Min-Kwan
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Hong Soon-Min
Samsung Electronics Co. Ltd.
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Shin Hyoyoung
Samsung Electronics Co. Ltd.
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Moon Young-jun
Samsung Electronics Co. Ltd.
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Kim Yu-Na
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Ko Min-Kwan
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Kim Yu-na
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Jung Seung-boo
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Myung Woo-ram
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Lee Jong-Bum
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Jung Seung-Boo
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
著作論文
- 2P4-2 超音波によるプリント基板接合における機械特性への表面仕上げの影響(ポスターセッション)
- 1P1-11 大気圧プラズマ処理の超音波バンプボンディングにおよぼす影響(ポスターセッション)
- 1Pb-49 超音波接合されたフリップチップパッケージにおける非鉛エポキシソルダの熱特性(ポスターセッション)
- 1Pb-50 金属基板とフレキシブル基板の超音波接合特性(ポスターセッション)
- 1P1-12 フレキシブル電極パターンのガラス基板上への超音波ボンディングと諸条件の影響(ポスターセッション)
- 2-09P-48 プリント基板をフレキシブル基板間の接合強度に及ぼす溶接条件の影響(ポスターセッション 2)
- 2-09-03 超音波ボンディングされたフリップチップバンプとフレキシブル基板の接合強度への大気圧プラズマの影響(強力超音波)
- 2Pb4-1 超音波溶接によるRPCB/FPCB境界間のCu-Cu直接接合の信頼性(ポスターセッション)