2P4-2 超音波によるプリント基板接合における機械特性への表面仕上げの影響(ポスターセッション)
スポンサーリンク
概要
- 論文の詳細を見る
The purpose of this paper is to find the effect of surface finish on electrodes between the rigid printed circuit board (RPCB) and flexible PCB (FPCB) using ultrasonic vibration. The electrodes of the FPCB were electroless-plated with electroless Ni/immersion Au (ENIG) and electroless Ni/electroless Pd/immersion Au (ENEPIG) and those of RPCB were electroless-plated with ENIG. The peel strengths of the joints were investigated with various parameters, such as bonding pressure and time. This study showed that the thickness of intermetallic compound (IMC) bonded with ENEPIG surface finish was thinner than that bonded with ENIG surface finish.
- 2009-11-18
著者
-
Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
-
JUNG Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University
-
Lee Jong-Gun
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
-
Jung Seung‐boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
-
Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
-
Lee Jong-bum
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
関連論文
- 2P4-2 超音波によるプリント基板接合における機械特性への表面仕上げの影響(ポスターセッション)
- Microstructure and Mechanical Properties of Friction Stir Spot Welded Galvanized Steel
- Structure-Properties Relations in Friction Stir Spot Welded Low Carbon Steel Sheets for Light Weight Automobile Body
- Effect of Cr Thickness on Adhesion Strength of Cu/Cr/Polyimide Flexible Copper Clad Laminate Fabricated by Roll-to-Roll Process
- 1P1-11 大気圧プラズマ処理の超音波バンプボンディングにおよぼす影響(ポスターセッション)
- Effect of Pin Shapes on Joint Characteristics of Friction Stir Spot Welded AA5J32 Sheet
- Electromigration Behavior of through-Si-via (TSV) Interconnect for 3-D Flip Chip Packaging
- 1Pb-49 超音波接合されたフリップチップパッケージにおける非鉛エポキシソルダの熱特性(ポスターセッション)
- 1Pb-50 金属基板とフレキシブル基板の超音波接合特性(ポスターセッション)
- Microstructures and Mechanical Properties of Double-Friction Stir Welded 2219 Al Alloy
- 1P1-12 フレキシブル電極パターンのガラス基板上への超音波ボンディングと諸条件の影響(ポスターセッション)
- 2-09P-48 プリント基板をフレキシブル基板間の接合強度に及ぼす溶接条件の影響(ポスターセッション 2)
- 2-09-03 超音波ボンディングされたフリップチップバンプとフレキシブル基板の接合強度への大気圧プラズマの影響(強力超音波)
- The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
- Characterization of Failure Behaviors in Anisotropic Conductive Interconnection
- Reaction Diffusion and Formation of Cu_In_9 and In_Ni_ Phases in the Couple of Indium-Substrates
- Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics
- Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate
- Transmission property of flip chip package with adhesive interconnection for high frequency applications
- Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint
- 2Pb4-1 超音波溶接によるRPCB/FPCB境界間のCu-Cu直接接合の信頼性(ポスターセッション)
- Application of Underfill for Flip-Chip Package Using Ultrasonic Bonding
- Effect of Time and Pressure on Ultrasonic Bonding Strength of Flexible Printed Circuit Board to Glass with Nonconductive Film
- Electrical Characterization of Screen-Printed Conductive Circuit with Silver Nanopaste
- Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards
- Effect of Sintering Temperature on Electrical Properties of Chip on Glass Module with Direct Printing Method (Special Issue : Advanced Electromaterials)
- Microstructures and Mechanical Properties of Friction Stir Welded 2.25Cr-1Mo Steel