Characterization of Failure Behaviors in Anisotropic Conductive Interconnection
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2007-05-01
著者
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JUNG Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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YOON Jeong-Won
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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Jung Seung‐boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Yoon Jeong-won
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Koo Ja-myeong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Kim Kyung-sik
International Display Solution Co. Ltd.
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Nam Jae-do
School Of Applied Chemistry Sungkyunkwan University
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Kim Jong-woong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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KIM Dae-Gon
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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CHOI Sunglak
AMLCD Division, Samsung Electronics Co., Ltd.
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LEE Hoo-Jeong
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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JOO Jinho
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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Joo Jinho
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Kim Dae-gon
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Choi Sunglak
Amlcd Division Samsung Electronics Co. Ltd.
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Lee Hoo-jeong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Lee Hoo-jeong
School Of Advanced Material Science Sungkyunkwan University
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Jung Seung‐boo
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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