2-09-03 超音波ボンディングされたフリップチップバンプとフレキシブル基板の接合強度への大気圧プラズマの影響(強力超音波)
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概要
- 論文の詳細を見る
Horizontal ultrasonic vibration was employed to bond the Au flip chip bump with a flexible printed circuit board (FPCB). This study was focused on the atmospheric pressure plasma cleaning conditions on the ultrasonic bonding strength of the Au bump, because the cleanness and roughness of the bump surface strongly affected the joint integrity. The optimized ultrasonic conditions greatly enhanced the joint strength bonded using ultrasonic energy, while the excessive plasma treatment degrated the joint integrity. In this study, the mechanisms why the joint strength was determined by the treatment conditions were examined and discussed using X-ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES) and atomic force microscopy (AFM).
- 超音波エレクトロニクスの基礎と応用に関するシンポジウム運営委員会の論文
- 2007-11-14
著者
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jo Jung-Lae
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Koo Ja-Myeong
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Lee Jong-Bum
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jung Seung-Boo
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Moon Jeong-Hoon
Suwon Sci. College, Dept. of Mechanical Eng.
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Jung Seung‐boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jung Seung‐boo
Sungkyunkwan Univ. Suwon Kor
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Koo Ja-myeong
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Kim Yu‐na
Sungkyunkwan Univ. Gyeonggi Kor
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Moon Won-chul
Sungkyunkwan Univ. Micro Electronic Packaging Consortium
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Moon Jeong‐hoon
Suwon Sci. College Dept. Of Mechanical Eng.
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Kim Yu-Na
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Lee Jong-bum
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Moon Jeong-hoon
Suwon Sci. College Dept. Of Mechanical Eng.
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Kim Yu-na
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Jo Jung-lae
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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