1Pb-50 金属基板とフレキシブル基板の超音波接合特性(ポスターセッション)
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概要
- 論文の詳細を見る
The purpose of this paper is to find bonding parameters of electrodes between the metal printed circuit board (PCB) and flexible PCB using ultrasonic vibration. The electrodes of FPCB were electroless-plated with electroless Ni/immersion Au (ENIG) and those of metal PCB were also electroless-plated with ENIG. The peel strengths of the joints were investigated with various parameters, such as bonding pressure and time. This study showed that the electrodes between the metal PCB and FPCB were successfully bonded without any adhesive at a low temperature during a short time, compared to other bonding methods: adhesive bonding and thermo-compression bonding.
- 2010-12-06
著者
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-Bum
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jung Seung-Boo
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jung Seung‐boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Koh Min-kwan
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-Gun
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Lee Jong-bum
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Ko Min-Kwan
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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