Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate

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This study was focused on the effect of atmospheric pressure plasma treatment conditions on the ultrasonic bonding properties of Au flip-chip bumps on Au-finished glass substrates. The spreading test of de-ionized (DI) water was carried out on the substrate after the treatment. The plasma treatment was performed with three different gases, N2, N2 + O2, and N2 + H2, for various treatment times from 0.3 to 18 s. The surface analysis was carried out after the treatment using Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS). The treatment conditions greatly affected the spreading angle and joint strength. The addition of O2 and H2 gases to N2 gas was effective to improve the wettability of the Au-finished substrate and the bondability between the Au bump and substrate, respectively. The spreading angle rapidly decreased with increasing treatment time from 0.3 to 1 s and then decreased slightly with further increase in the treatment time, whereas the bonding strength peaked after the treatment for 0.5 to 2 s and then decreased.
2008-05-25