Jo Jung-Lae | School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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概要
- Jo Jung-Laeの詳細を見る
- 同名の論文著者
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Koreaの論文著者
関連著者
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-Gun
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Koo Ja-myeong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Noh Bo-in
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Moon Jeong-Hoon
Department of Mechanical Engineering, Suwon Science College, Hwaseong, Gyeonggi 440-746, Republic of Korea
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Shin Young-eui
School Of Mechanical Engineering Chung-ang University
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Jeon Sung-ho
School Of Mechanical Engineering Chung-ang University
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Kim Jong-woong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Kim Jong-Min
School of Chemical Engineering & Material Science, Chung-Ang University
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Lee Jong-Gun
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Koo Ja-Myeong
Mechatronics and Manufacturing Technology Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Chun Chang-Keun
Welding Research Center, Research Institute of Industrial Science and Technology, Pohang, Gyeongbuk 790-330, Republic of Korea
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Lee Jong-Bum
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Lee Jong-Bum
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Kim Jong-Min
School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea
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Moon Jeong-Hoon
Department of Mechanical Engineering, Suwon Science College, Hwaseong, Gyeonggi-do 440-746, Republic of Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea
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Koo Ja-Myeong
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Koo Ja-Myeong
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea
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Kim Yu-Na
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Kim Dae-Up
Materials Research Department, Hyundai MOBIS Co., Yongin, Gyeonggi 446-912, Republic of Korea
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Yoo Choong-Don
Department of Mechanical Engineering, KAIST, Daejon, 305-701 Republic of Korea
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Noh Bo-In
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Noh Bo-In
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea
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Shin Young-Eui
School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Kim Jong-Woong
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
著作論文
- Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics
- Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate
- Application of Underfill for Flip-Chip Package Using Ultrasonic Bonding
- Effect of Time and Pressure on Ultrasonic Bonding Strength of Flexible Printed Circuit Board to Glass with Nonconductive Film