Shin Young-eui | School Of Mechanical Engineering Chung-ang University
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概要
関連著者
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Shin Young-eui
School Of Mechanical Engineering Chung-ang University
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Kim Jong-Min
School of Chemical Engineering & Material Science, Chung-Ang University
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Lee Seong
School of Electrical Engineering, Pusan National University, Busan 609-735, Korea
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LEE Seong
School of Mechanical Engineering, Chung-Ang University
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Lee Seong
School Of Mechanical Engineering Chung-ang Univ.
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Kim Jong-min
School Of Mechanical Engineering Chung-ang Univ.
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Kim Jooheon
School Of Mechanical Engineering Chung-ang University
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SONG Yong
School of Mechanical Engineering, Chung-Ang University
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SHIN Young-Eui
School of Mechanical Engineering, Chung-Ang University
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Lee Seong
School Of Mechanical Engineering Chung-ang University
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Yim Byung-seung
School Of Mechanical Engineering Chung-ang Univ.
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Jeon Sung-ho
School Of Mechanical Engineering Chung-ang University
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Kim Jooheon
School Of Chemical Engineering & Material Sci. Chung-ang Univ.
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-Gun
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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CHO Minhaeng
School of Mechanical Engineering, Chung-Ang University
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Yim Byung-seung
School Of Mechanical Engineering Chung-ang University
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Cho Minhaeng
School Of Mechanical Engineering Chung-ang Univ.
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Han Jung-geun
Department Of Civil & Environmental Engineering Chung-ang University
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JEON Sung-Ho
School of Mechanical Engineering, Chung-Ang University
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EOM Yong-Sung
Electronics and Telecommunications Research Institute
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Lee Jeong
School Of Electrical And Electronics Eng. Chung-ang University
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Kim Jooheon
School Of Chemical Engineering & Materials Sci. Chung-ang Univ.
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Yim Byung-Seung
School of Mechanical Engineering, Chung-Ang University
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Kim Jong-Min
School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea
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Moon Jeong-Hoon
Department of Mechanical Engineering, Suwon Science College, Hwaseong, Gyeonggi 440-746, Republic of Korea
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Moon Jeong-Hoon
Department of Mechanical Engineering, Suwon Science College, Hwaseong, Gyeonggi-do 440-746, Republic of Korea
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Yoo Choong-Don
Department of Mechanical Engineering, KAIST, Daejon, 305-701 Republic of Korea
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Shin Young-Eui
School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea
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LEE Jeong
School of Mechanical Engineering, Chung-Ang University
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HEO Yuseon
School of Chemical Engineering & Material Science, Chung-Ang University
著作論文
- Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
- Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
- Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics
- Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers