Kim Jong-min | School Of Mechanical Engineering Chung-ang Univ.
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概要
関連著者
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Kim Jong-min
School Of Mechanical Engineering Chung-ang Univ.
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Kim Jong-Min
School of Chemical Engineering & Material Science, Chung-Ang University
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LEE Seong
School of Mechanical Engineering, Chung-Ang University
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Lee Seong
School Of Mechanical Engineering Chung-ang Univ.
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Lee Seong
School of Electrical Engineering, Pusan National University, Busan 609-735, Korea
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Kim Jooheon
School Of Mechanical Engineering Chung-ang University
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Yim Byung-seung
School Of Mechanical Engineering Chung-ang University
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Yim Byung-seung
School Of Mechanical Engineering Chung-ang Univ.
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Lee Seong
School Of Mechanical Engineering Chung-ang University
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Kim Jooheon
School Of Chemical Engineering & Material Sci. Chung-ang Univ.
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CHO Minhaeng
School of Mechanical Engineering, Chung-Ang University
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Cho Minhaeng
School Of Mechanical Engineering Chung-ang Univ.
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Han Jung-geun
Department Of Civil & Environmental Engineering Chung-ang University
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SONG Yong
School of Mechanical Engineering, Chung-Ang University
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SHIN Young-Eui
School of Mechanical Engineering, Chung-Ang University
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JEON Sung-Ho
School of Mechanical Engineering, Chung-Ang University
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Shin Young-eui
School Of Mechanical Engineering Chung-ang University
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Jeon Sung-ho
School Of Mechanical Engineering Chung-ang University
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Kim Jooheon
School Of Chemical Engineering & Materials Sci. Chung-ang Univ.
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LEE Jin
School of Engineering, Korea Advanced Institute of Science and Technology
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Lee Joonho
Department Of Materials Science And Engineering Korea University
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Lee Joonho
Department Of Materials Engineering And Processing Osaka University
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Kim Jae
School Of Civil Urban And Geosystem Engineering Seoul National University
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KIM Jong-Min
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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KIM Taeyoung
Department of Materials Science and Engineering, Korea University
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KIM Yunkyum
Department of Materials Science and Engineering, Korea University
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YUAN Zhangfu
Department of Energy & Resources Engineering, College of Engineering, Peking University
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EOM Yong-Sung
Electronics and Telecommunications Research Institute
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Kim Jong-min
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Lee Jung
Function Bay Inc.
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Shin Young
School Of Mechanical Engineering Chung-ang University
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Kim Yunkyum
Department Of Materials Science And Engineering Korea University
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Kim Taeyoung
Department Of Materials Science And Engineering Korea University
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Yuan Zhangfu
Department Of Energy & Resources Engineering College Of Engineering Peking University
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Kim Jae
School Of Chemical Engineering College Of Engineering Seoul National University
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Kim Jae
Korea Institute Of Machinery & Materials
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Lee Joonho
Dep. Of Materials Sci. And Engineering Korea Univ.
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Lee Jin
School Of Mechanical Engineering Chung-ang University
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Kim Yunkyum
Dep. Of Materials Sci. And Engineering Korea Univ.
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Lee Jin
School Of Engineering Korea Advanced Institute Of Science And Technology
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Lee Hyung
School Of Mechanical Engineering Chung-ang University
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Shin Young
School Of Mechanical Engineering Chung-ang Univ.
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Oh Seung-hoon
School Of Mechanical Engineering Chung-ang University
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KIM Jiwon
School of Chemical Engineering & Material Science, Chung-Ang University
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Kim Jong-Min
School of Mechanical Engineering, Chung-Ang University
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Kim Jae
School of Chemical and Biological Engineering, Seoul National University, Seoul 151-744, Korea
著作論文
- Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
- Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates
- Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
- Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
- Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler
- Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
- Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers
- Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)