Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2008-11-01
著者
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LEE Jin
School of Engineering, Korea Advanced Institute of Science and Technology
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LEE Seong
School of Mechanical Engineering, Chung-Ang University
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Lee Seong
School Of Mechanical Engineering Chung-ang Univ.
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Kim Jong-min
School Of Mechanical Engineering Chung-ang Univ.
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Kim Jae
School Of Civil Urban And Geosystem Engineering Seoul National University
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Lee Jung
Function Bay Inc.
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Kim Jae
School Of Chemical Engineering College Of Engineering Seoul National University
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Kim Jae
Korea Institute Of Machinery & Materials
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Lee Jin
School Of Mechanical Engineering Chung-ang University
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Lee Jin
School Of Engineering Korea Advanced Institute Of Science And Technology
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Kim Jong-Min
School of Mechanical Engineering, Chung-Ang University
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Kim Jong-Min
School of Chemical Engineering & Material Science, Chung-Ang University
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Lee Seong
School of Electrical Engineering, Pusan National University, Busan 609-735, Korea
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Kim Jae
School of Chemical and Biological Engineering, Seoul National University, Seoul 151-744, Korea
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