Kim Jong-Min | School of Chemical Engineering & Material Science, Chung-Ang University
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概要
- Kim Jong-Minの詳細を見る
- 同名の論文著者
- School of Chemical Engineering & Material Science, Chung-Ang Universityの論文著者
関連著者
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Kim Jong-Min
School of Chemical Engineering & Material Science, Chung-Ang University
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Kim Jong-min
School Of Mechanical Engineering Chung-ang Univ.
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Lee Seong
School of Electrical Engineering, Pusan National University, Busan 609-735, Korea
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LEE Seong
School of Mechanical Engineering, Chung-Ang University
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Lee Seong
School Of Mechanical Engineering Chung-ang Univ.
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Yim Byung-seung
School Of Mechanical Engineering Chung-ang Univ.
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Kim Jooheon
School Of Mechanical Engineering Chung-ang University
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Shin Young-eui
School Of Mechanical Engineering Chung-ang University
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Kim Jooheon
School Of Chemical Engineering & Material Sci. Chung-ang Univ.
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Yim Byung-seung
School Of Mechanical Engineering Chung-ang University
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Lee Seong
School Of Mechanical Engineering Chung-ang University
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Jeon Sung-ho
School Of Mechanical Engineering Chung-ang University
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CHO Minhaeng
School of Mechanical Engineering, Chung-Ang University
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Cho Minhaeng
School Of Mechanical Engineering Chung-ang Univ.
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Han Jung-geun
Department Of Civil & Environmental Engineering Chung-ang University
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SONG Yong
School of Mechanical Engineering, Chung-Ang University
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SHIN Young-Eui
School of Mechanical Engineering, Chung-Ang University
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JEON Sung-Ho
School of Mechanical Engineering, Chung-Ang University
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Kim Jooheon
School Of Chemical Engineering & Materials Sci. Chung-ang Univ.
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LEE Jin
School of Engineering, Korea Advanced Institute of Science and Technology
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-Gun
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Lee Byung
School Of Information And Telecommunication Korea Aerospace University
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Kim Jae
School Of Civil Urban And Geosystem Engineering Seoul National University
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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EOM Yong-Sung
Electronics and Telecommunications Research Institute
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Lee Jung
Function Bay Inc.
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Shin Young
School Of Mechanical Engineering Chung-ang University
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Kim Jae
School Of Chemical Engineering College Of Engineering Seoul National University
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Kim Jae
Korea Institute Of Machinery & Materials
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Lee Jeong
School Of Electrical And Electronics Eng. Chung-ang University
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Lee Jin
School Of Mechanical Engineering Chung-ang University
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Lee Jin
School Of Engineering Korea Advanced Institute Of Science And Technology
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Lee Hyung
School Of Mechanical Engineering Chung-ang University
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Shin Young
School Of Mechanical Engineering Chung-ang Univ.
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Oh Seung-hoon
School Of Mechanical Engineering Chung-ang University
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KIM Jiwon
School of Chemical Engineering & Material Science, Chung-Ang University
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Kim Jong-Min
School of Mechanical Engineering, Chung-Ang University
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Yim Byung-Seung
School of Mechanical Engineering, Chung-Ang University
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Kim Jong-Min
School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea
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Moon Jeong-Hoon
Department of Mechanical Engineering, Suwon Science College, Hwaseong, Gyeonggi 440-746, Republic of Korea
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Moon Jeong-Hoon
Department of Mechanical Engineering, Suwon Science College, Hwaseong, Gyeonggi-do 440-746, Republic of Korea
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Yoo Choong-Don
Department of Mechanical Engineering, KAIST, Daejon, 305-701 Republic of Korea
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Shin Young-Eui
School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea
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Kim Jae
School of Chemical and Biological Engineering, Seoul National University, Seoul 151-744, Korea
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea
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OH Seung
School of Mechanical Engineering, Chung-Ang University
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JEONG Jin
School of Mechanical Engineering, Chung-Ang University
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LEE Jeong
School of Mechanical Engineering, Chung-Ang University
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LEE Byung
School of Mechanical Engineering, Chung-Ang University
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HEO Yuseon
School of Chemical Engineering & Material Science, Chung-Ang University
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SONG Hojin
School of Mechanical Engineering, Chung-Ang University
著作論文
- Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
- Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
- Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
- Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler
- Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics
- Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
- Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)
- Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)
- Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers