Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)

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概要

• 論文の詳細を見る
• 2012-12-01

著者

• Lee Byung

  School Of Information And Telecommunication Korea Aerospace University

• Yim Byung-seung

  School Of Mechanical Engineering Chung-ang Univ.

• Kim Jong-Min

  School of Chemical Engineering & Material Science, Chung-Ang University

• OH Seung

  School of Mechanical Engineering, Chung-Ang University

• JEONG Jin

  School of Mechanical Engineering, Chung-Ang University

• LEE Byung

  School of Mechanical Engineering, Chung-Ang University

• SONG Hojin

  School of Mechanical Engineering, Chung-Ang University

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• Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics
• Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
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• Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)
• Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)
• Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers

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