Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)

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Wetting Transition Characteristics on Microstructured Hydrophobic Surfaces
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Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
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Numerical Analysis of Coalescence Characteristics of Low Melting Point Alloy Fillers Using a Non-Equilibrium Phase Field Model
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Comparison of Theoretical Models of Electron-Phonon Coupling in Thin Gold Films Irradiated by Femtosecond Pulse Lasers
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Flattening Characteristics of Ni_Cr Thermal-Sprayed Coating Layers on Preheated SCM415 Substrates
Thermal Conductivity and Interconnectivity of Hexamethylene Diisocyanate Contained Polyurethane Grafted Multiwall Carbon Nanotube/Polyurethane Nanocomposite Film
Modeling of Droplet Collision Process in Inter-Spray Impingement System
Thermal Boundary Resistance Effect on Non-Equilibrium Energy Transport in Metal-Dielectric Thin Films Heated by Femtosecond Pulse Lasers
Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers
Multi-Dimensional Liquid Crystal Alignment Effect of Polymer Wall on Vertically Aligned Liquid Crystal Cell
Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)
Viewing Angle Control of a Fringe-Field Switching Cell by Electrical Tilting of Liquid Crystal
Enhancement of Electrooptical Properties of Optically Compensated Bend Cell with Pixel-Isolating Polymer Wall
Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)
Effect of Flame Spray Distance on the Adhesive Characteristics of Ni-20mass%Cr Layers on SCM415 Substrates
Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers
Dynamic Behavior of Non-Newtonian Droplets Impinging on Solid Surfaces

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