Thermal Conductivity and Interconnectivity of Hexamethylene Diisocyanate Contained Polyurethane Grafted Multiwall Carbon Nanotube/Polyurethane Nanocomposite Film
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2011-03-01
著者
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Kim Jooheon
School Of Chemical Engineering & Materials Sci. Chung-ang Univ.
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Im Hyungu
School Of Chemical Engineering & Materials Sci. Chung-ang Univ.
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Im Hyungu
School Of Chemical Engineering & Materials Science Chung-ang University
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YUN Sungjin
School of Chemical Engineering & Materials Science, Chung-Ang University
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Yun Sungjin
School Of Chemical Engineering & Materials Science Chung-ang University
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Kim Jooheon
School Of Chemical Engineering & Material Sci. Chung-ang Univ.
関連論文
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- Thermal Conductivity and Interconnectivity of Hexamethylene Diisocyanate Contained Polyurethane Grafted Multiwall Carbon Nanotube/Polyurethane Nanocomposite Film
- Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)
- Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers