Novel Miscible Blends Composed of Poly(Methyl Methacrylate) and 2,2-Bis(3,4-Carboxyphenyl)Hexafluoropropane Dianhydride-Based Polyimides with Optical Grade Clarity
スポンサーリンク
概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2009-07-01
著者
-
Kim Jooheon
School Of Mechanical Engineering Chung-ang University
-
Kim Hyomi
School Of Chemical Engineering And Materials Science Chung-ang University
-
IM Hyungu
School of Chemical Engineering and Materials Science, Chung-Ang University
-
Im Hyungu
School Of Chemical Engineering And Materials Science Chung-ang University
-
Kim Jooheon
School Of Chemical Engineering & Materials Sci. Chung-ang Univ.
-
Im Hyungu
School Of Chemical Engineering & Materials Sci. Chung-ang Univ.
-
Kim Jooheon
School Of Chemical Engineering & Material Sci. Chung-ang Univ.
関連論文
- Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
- Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
- Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
- Novel Miscible Blends Composed of Poly(Methyl Methacrylate) and 2,2-Bis(3,4-Carboxyphenyl)Hexafluoropropane Dianhydride-Based Polyimides with Optical Grade Clarity
- Thermal Conductivity and Interconnectivity of Hexamethylene Diisocyanate Contained Polyurethane Grafted Multiwall Carbon Nanotube/Polyurethane Nanocomposite Film
- Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)
- Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers