Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)
スポンサーリンク
概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2012-03-01
著者
-
Kim Jong-min
School Of Mechanical Engineering Chung-ang Univ.
-
Kim Jooheon
School Of Mechanical Engineering Chung-ang University
-
Yim Byung-seung
School Of Mechanical Engineering Chung-ang University
-
Yim Byung-seung
School Of Mechanical Engineering Chung-ang Univ.
-
Kim Jooheon
School Of Chemical Engineering & Material Sci. Chung-ang Univ.
-
Oh Seung-hoon
School Of Mechanical Engineering Chung-ang University
-
KIM Jiwon
School of Chemical Engineering & Material Science, Chung-Ang University
-
Kim Jong-Min
School of Chemical Engineering & Material Science, Chung-Ang University
関連論文
- Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
- Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates
- Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
- Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
- Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler
- Novel Miscible Blends Composed of Poly(Methyl Methacrylate) and 2,2-Bis(3,4-Carboxyphenyl)Hexafluoropropane Dianhydride-Based Polyimides with Optical Grade Clarity
- Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics
- Thermal Conductivity and Interconnectivity of Hexamethylene Diisocyanate Contained Polyurethane Grafted Multiwall Carbon Nanotube/Polyurethane Nanocomposite Film
- Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
- Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers
- Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)
- Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)
- Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers
- The 2010 Korean soil preservation act : Will stabilization techniques still be feasible?