Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates

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New Process of Self-Organized Interconnection in Packaging Using Conductive Adhesive with Low Melting Point Filler
Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive
The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly
Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates
Interfacial Kinetics of Nitrogen with Molten Iron Containing Sulfur
Dynamic Interfacial Phenomena between Gas, Liquid Iron and Solid CaO during Desulfurization
Characterization of Fibrous Particles in Blast Furnace Slag Quenched by Water-spray
Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
Oxygen Adsorption Behavior on the Surface of Liquid Cu-Ag Alloys
Effect of Oxygen on Surface Tension of Liquid Ag-Sn Alloys
Loacl Corrosion of Solid Silica at the Surface of Molten Silicon
Trial to Evaluate Wettability of Liquid Zn with Steel Sheets Containing Si and Mn
Wettability and Interfacial Permeability between Prereduced Ilmenite and Molten Pig Iron
Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler
Parametric Design for Resin Self-Alignment Capability(Electronic Components)
Reduction Extraction Kinetics of Titania and Iron from an Ilmenite by H_2-Ar Gas Mixtures
Improvement of Board Level Reliability for μBGA Solder Joints Using Underfill
Interfacial Phenomena Between Gas, Liquid Iron and Sold Lime During Desulfurization
Determination of Macro-Contact Angle and Line Tension at High Temperatures for Au/Al_2O_3 System at 1373K Using a Micro-Scale Wetting Method
3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material
New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers
Three-dimensional Compressible Flow Simulation of Top-blown Multiple Jets in Converter
New Process of Self-Organized Interconnection in Packaging Using Conductive Adhesive with Low Melting Point Filler
Surface Tension of Liquid Fe-Ti Alloys at 1 823K
Improvements in Surface Tension Measurements of Liquid Metals Having Low Capillary Constants by the Constrained Drop Method
Preparation and Thermal Analysis of Sn-Ag Nano Solders
Effect of Structure on the Viscosity of Silicate Melts
Surface Tension and its Temperature Coefficient of Liquid Sn-X (X=Ag, Cu) Alloys
Measurement of the Density of Molten Silicon by a Modified Sessile Drop Method
Wettability of Ceramics with Molten Silicon at Temperatures Ranging form 1693 to 1773K
Effects of Boron and Carbon on the Surface Tension of Molten Silicon under Precisely Controlled Oxygen Partial Pressure
Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers
Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)
Recovery of Fe and P from CaO-SiO_2-Fe_tO-P_2O_5 Slag by Microwave Treatment
SNPs in axon guidance pathway genes and susceptibility for Parkinson's disease in the Korean population
Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu Alloys on Copper Substrates
Density Measurements of CaO–MnO–SiO2 Slags
Wettability between Molten Slag and MgO–C Refractories for the Slag Splashing Process

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