Parametric Design for Resin Self-Alignment Capability(Electronic Components)

概要

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We have developed a novel self-alignment process using the surface tension of the liquid resin for assembly of electronic and optoelectronic devices. Due to their characteristics of low surface tension, however, the parametric design guidelines are necessary for resin self-alignment capability. In this paper, a shape prediction mathematical model and a numerical method are developed. The developed system is capable of achieving the liquid joint geometry and the parametric design for self-alignment capability. The influences of geometric parameters such as liquid volume, component weight, pad radius, liquid surface tension on the shape of liquid joint are investigated. Furthermore, the parametric design guidelines considered the process-related practical matters of misalignment level, distribution of the supplied liquid volumes and coplanarity deviation includes difference of the height between the pads are provided.
社団法人電子情報通信学会の論文
2003-10-01