New Process of Self-Organized Interconnection in Packaging Using Conductive Adhesive with Low Melting Point Filler
スポンサーリンク
概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2004-04-30
著者
-
Yasuda Masahiro
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
-
YASUDA Kiyokazu
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
-
KIM Jong-Min
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
-
FUJIMOTO Kozo
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
関連論文
- AN-P6 Effect of fibroblast cell which grew on amphiphilic polymer particle on the proliferation and differentiation of blood progenitor cell(Section I Animal and Plant Cell Cultures)
- Scanning Electron Microscopic Study of Vascular and Biliary Casts in Chicken and Duck Liver
- Secondary Lymphoid Areas in Calf Ileal Peyer's Patch(Anatomy)
- Class swith recombination of the chicken lgh chain genes: implications for the primordial switch region repeats
- New Process of Self-Organized Interconnection in Packaging Using Conductive Adhesive with Low Melting Point Filler
- Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive
- The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly
- Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates
- Purification and Characterization of Organic Solvent-Stable Protease from Organic Solvent-Tolerant Pseudomonas aeruginosa PST-01
- Kinetics of Solution Polymerization and Seed Polymerization of 2-[p-(1,1,3,3-Tetramethyl-Butyl) Phenoxy-Polyethoxy] Ethyl Methacrylate Macromonomers
- Purification and Characterization of Organic Solvent-Stable Lipase from Organic Solvent-Tolerant Pseudomonas aeruginosa LST-03
- Development of Novel Immobilization Supports of Lipase for Reactions in Organic Media : Seed Polymerization of Amphiphilic 2-[p-(1,1,3,3-Tetramethyl-Butyl) Phenoxy-Polyethoxy] Ethyl Methacrylate Macromonomers
- Synthesis and Radical Polymerization Kinetics of Amphiphilic Methacrylic Monomers Having 2-[p-(1,1,3,3-Tetramethyl-Butyl)Phenoxy-Polyethoxy]Ethyl Group
- Effect of Additives on Transesterification Activity of Rhizopus chinensis Lipase
- Experimental Investigation of Fructose 1, 6-Diphosphate Production and Simultaneous ATP Regeneration by Conjugated Enzymes in an Ultrafiltration Hollow-Fiber Reactor
- Theoretical Investigation of Fructose 1, 6-Diphosphate Production and Simultaneous ATP Regeneration by Conjugated Enzymes in an Ultrafiltration Hollow-Fiber Reactor
- Purification and Characterization of Lipase from Rhizopus chinensis Cells
- Peptide Synthesis Catalyzed by Organic Solvent-Stable Protease from Pseudomonas aeruginosa PST-01 in Monophasic Aqueous-Organic Solvent Systems
- Enzymatic Production of Fructose 1, 6-Diphosphate Using Crude Cell Extract of Bacillus stearothermophilus
- Enzymatic Synthesis of Fructose 1, 6-Diphosphate with ATP Regeneration in a Batch Reactor and a Semibatch Reactor Using Purified Enzymes of Bacillus stearothermophilus
- The Kinetics and Mechanism of a Reaction Catalyzed by Bacillus stearothermophilus Phosphoglucose Isomerase
- Highly Precise Positioning Method by Pull-Up Model Self-Alignment Process Using Liquid Surface Tension
- Assembly of Cardiac C-protein during Myofibrillogenesis in Myogenic Cells in Culture
- Parametric Design for Resin Self-Alignment Capability(Electronic Components)
- Improvement of Board Level Reliability for μBGA Solder Joints Using Underfill
- Investigation on Welding Process and Welding Parameters in Resistance Spot Welding Process with High-Current Density and Short Current Duration
- 3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material
- New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers
- New Process of Self-Organized Interconnection in Packaging Using Conductive Adhesive with Low Melting Point Filler
- Suitable Conditions for Connections through the Plated Through Hole of Printed Circuit Boards