Suitable Conditions for Connections through the Plated Through Hole of Printed Circuit Boards

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概要

• 論文の詳細を見る

• B-ISDN telecommunication systems will require signal processing speeds up to 600 Mbps or more. We must therefore consider the affects of signal reflection, signal attenuation, time delay, and so on when designing these systems. The higher the signal speed, the larger the electrical noise induced around the connector, especially in the plated through holes (PTHs) area. This paper presents the results of our investigation focused on connector mounting configurations in the signal transmission line, especially whether or not signals transmit through the PTH in a printed circuit board (PCB). How the signal reflection characteristics depend upon transmission line configurations are discussed and experimental results and simulation analyses for a transmission line system using a small miniature A-type (SMA) connector as an example are performed. It is suggested that designs for future high-speed signal transmission circuits take into account the PTH diameter and/or the PTH pitch conditions, values for which can be determined from simulation analysis.

• 社団法人電子情報通信学会の論文
• 1995-03-25

著者

• Oka Hiroki

  Ntt Network Service Systems Laboratories

• YASUDA Kiyokazu

  Department of Manufacturing Science, Graduate School of Engineering, Osaka University

• Sugiura Nobuaki

  NTT Network Service Systems Laboratories

• Yasuda Kei-ichi

  NTT Network Service Systems Laboratories

• Sugiura N

  Ntt Network Service Systems Laboratories

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• New Process of Self-Organized Interconnection in Packaging Using Conductive Adhesive with Low Melting Point Filler
• Suitable Conditions for Connections through the Plated Through Hole of Printed Circuit Boards
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