Improvement of Board Level Reliability for μBGA Solder Joints Using Underfill
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概要
- 論文の詳細を見る
- 2003-10-01
著者
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KIM Jong-Min
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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Kim Jong-min
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Shin Young-eui
Department Of Mechanical Engineering Chungang University
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Shin Young-eui
Department Of Mechanical Engineering Chung-ang University
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FARSON Dave
Department of Industrial, Welding and Systems Engineering, The Ohio State University
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Farson Dave
Department Of Industrial Welding And Systems Engineering The Ohio State University
関連論文
- New Process of Self-Organized Interconnection in Packaging Using Conductive Adhesive with Low Melting Point Filler
- Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive
- The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly
- Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates
- Parametric Design for Resin Self-Alignment Capability(Electronic Components)
- Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder
- The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
- Improvement of Board Level Reliability for μBGA Solder Joints Using Underfill
- 3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material
- New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers
- Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis
- New Process of Self-Organized Interconnection in Packaging Using Conductive Adhesive with Low Melting Point Filler
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