Shin Young-eui | Department Of Mechanical Engineering Chungang University
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概要
関連著者
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Shin Young-eui
Department Of Mechanical Engineering Chungang University
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Shin Young-eui
Department Of Mechanical Engineering Chung-ang University
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Shin Y‐e
Chung‐ang Univ. Seoul Kor
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Jung Seung-boo
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Jung S‐b
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Jung Seung-boo
Department Of Advanced Materials Engineering Sungkyunkwan University
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Lee C‐b
Department Of Advanced Materials Engineering Sungkyunkwan University
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Jung Seung-boo
School Of Advanced Materials Sci. And Engineering Sungkyunkwan Univ.
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KIM Jong-Min
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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Kim Jong-min
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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SHUR Chang-Chae
Department of Advanced Materials Engineering, Sungkyunkwan University
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Shur Chang-chae
Department Of Advanced Materials Engineering Sungkyunkwan University
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JUNG Jae
Department of Interaction Design. Graduate School of Techno Design. Kookmin University
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JUNG Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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Kim J‐m
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Lee Chang-bae
Department Of Advanced Materials Engineering Sungkyunkwan University
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Kim Jong-min
Materials & Devices Lab. Samsung Advanced Institute Of Technology
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Kim Jong-min
Hyundai Electronics Industries Co. Ltd.
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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YASUDA Kiyokazu
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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FUJIMOTO Kozo
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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Jung Jae
Department Of Dermatology Behavioral Science Seoul National University College Of Medicine
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Lee Kyung-woo
Department Of Mechanical Engineering Chung-ang University
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Fujimoto K
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Fujimoto Kozo
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Fujimoto K
Fais University Of Tsububa
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Chang Kyong-ho
Department Of Civil And Environmental Engineering Chung-ang University
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LEE Chang-Bae
School of Metallurgical and Materials Engineering, SungKyunKwan University
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SHUR Chang-Chae
School of Metallurgical and Materials Engineering, SungKyunKwan University
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FARSON Dave
Department of Industrial, Welding and Systems Engineering, The Ohio State University
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Farson Dave
Department Of Industrial Welding And Systems Engineering The Ohio State University
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Jung Seung-boo
Department Of Metallurgical Engineering Sung Kyun Kwan University
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Jung Jae
Department Of Biology Sunchon National University
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Lee Kwng-Woo
Department of Mechanical Engineering, Chung-Ang University
著作論文
- Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder
- The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
- Improvement of Board Level Reliability for μBGA Solder Joints Using Underfill
- 3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material
- Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis