Kim Jong-min | Hyundai Electronics Industries Co. Ltd.
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概要
関連著者
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Kim Jong-min
Hyundai Electronics Industries Co. Ltd.
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Kim J‐m
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Kim Jong-min
Materials & Devices Lab. Samsung Advanced Institute Of Technology
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Fujimoto K
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Fujimoto K
Fais University Of Tsububa
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YASUDA Kiyokazu
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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KIM Jong-Min
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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FUJIMOTO Kozo
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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Kim Jong-min
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Fujimoto Kozo
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Son Jeong-hwan
Hyundai Electronics Industries Co. Ltd.
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Jung Jong-wan
Hyundai Electronics Industries Co. Ltd.
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Jung J‐w
Hanyang Univ. Seoul Kor
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Lee Joo-hyoung
Memory R&d Division Hynix Semiconductor Co.
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Kim J‐m
Fed Project Samsung Advanced Institute Of Technology
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Lee Y‐j
Samsung Electronics Co. Ltd. Kyunggi‐do Kor
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Jeon D
Korea Advanced Inst. Of Sci. And Technol. Daejeon Kor
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Jeon Duk
Department Of Materials Science And Engineering Korea Advanced Institute Of Science And Technology
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Lee J‐h
Lg Electronics Inst. Technol. Seoul Kor
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Lee Young-jong
Lg Semicon. Ltd.
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Lee Young-jong
Advanced Technology Laboratory Lg Semicon Co. Ltd.
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Yasuda Masahiro
Department Of Manufacturing Science Graduate School Of Engineering Osaka University
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Yasuda Masahiro
Department Of Chemical Engineering Osaka Prefecture University
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Lee J‐h
Wonkwang Univ. Chonpuk Kor
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LEE Jin-Ho
Materials & Devices Lob., Sarnsung Advanced Institute of Technology
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CHOI Byoung-So
Materials & Devices Lob., Samsung Advanced Institute of Technology
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Lee Youngjong
Hyundai Electronics Industries Co. Ltd.
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Lee Young-jong
Advanced Technology Laboratory. Lg Semicon Co.
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Son J‐h
Hyundai Electronics Industries Co. Ltd.
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Nakata S
Graduate School Of Engineering Osaka University
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Chop Byoung-so
Materials & Devices Lab. Samsung Advanced Institute Of Technology
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Ko Young-chul
Materials & Devices Lab. Samsung Advanced Institute Of Technology
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Lee Jin-ho
Material Research And Development Laboratory Japan Fine Ceramics Center
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Ko Young-chul
Department Of Biomedical Laboratory Science College Of Biomedical Science And Engineering Inje Unive
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Jeon Duk
Department Of Materials Science And Engineering Korea Advanced Institute Of Science & Technology
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Lee Ju-Hyeon
School of Electrical Engineering, Wonkwang University
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YASUDA Masahiro
Department of Anatomy, Kumamoto University Medical School
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LEE Young-Jong
LG Semicon.,Ltd.
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Lee Kyung-ho
Lg Semicon Co. Ltd.
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Shin Y‐e
Chung‐ang Univ. Seoul Kor
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KO Young-Chu
Materials & Devices Lob., Samsung Advanced Institute of Technology
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MUN Yong-Kweun
Materials & Devices Lob., Samsung Advanced Institute of Technology
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KO Young-Chul
Materials & Devices Lab., Samsung Advanced institute of Technology
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CHOP Byoung-So
Materials & Devices Lab., Samsung Advanced institute of Technology
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LEE Youngjong
Hyundai Electronics Industries Co., Ltd.
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JUNG Jong-Wan
LG Semicon Co., Ltd.
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KIM Jong-Min
LG Semicon Co., Ltd.
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SON Jeong-Hwan
LG Semicon Co., Ltd.
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CHUNG Shin-Young
LG Semicon Co., Ltd.
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KIM Hyun-Cheol
LG Semicon Co., Ltd.
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Shin Young-eui
Department Of Mechanical Engineering Chungang University
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Shin Young-eui
Department Of Mechanical Engineering Chung-ang University
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Mun Yong-kweun
Materials & Devices Lob. Samsung Advanced Institute Of Technology
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Kim Hyun-cheol
Lg Semicon Co. Ltd.
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KIM Jong-Min
Graduate School of Engineering, Osaka University
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YASUDA Kiyokazu
Graduate School of Engineering, Osaka University
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FUJIMOTO Kozo
Graduate School of Engineering, Osaka University
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NAKATA Shuji
Graduate School of Engineering, Osaka University
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FUJIMOTO Kozo
the Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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KIM Jong-Min
the Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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NAKATA Shuji
the Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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Chung Shin-young
Lg Semicon Co. Ltd.
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Yasuda Kiyokazu
Graduate School Of Engineering Osaka University
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RITO Masahiro
Sakaiko Power Plant, Kansai Electric Power Co. Ltd.
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Rito Masahiro
Sakaiko Power Plant Kansai Electric Power Co. Ltd.
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Kjm Jong-Min
Department of Manufacturing Science, Graduate School of Engineering, Osaka University
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Kim Jong-Min
Hyundai Electronics Industries Co., Ltd., 1, Hyangjeong-dong, Hungduk-gu, Cheongju, 361-480, Korea
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Son Jeong-Hwan
Hyundai Electronics Industries Co., Ltd., 1, Hyangjeong-dong, Hungduk-gu, Cheongju, 361-480, Korea
著作論文
- Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive
- The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly
- Laser Graphic Video Display using Silicon Scanning Mirrors with Vertical Comb Fingers
- Characterization of Silicon Scanning Mirror for Laser Display
- Dependence of Subthreshold Hump and Reverse Narrow Channel Effect on the Gate Length by Suppression of Transient Enhanced Diffusion at Trench Isolation Edge
- Dependence of Sub-Threshold Hump and RNWE Characteristics on the Gate Length by TED
- Highly Precise Positioning Method by Pull-Up Model Self-Alignment Process Using Liquid Surface Tension
- Self-Alignment Process Using Liquid Resin for Assembly of Electronic or Optoelectronic Devices
- 3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material
- New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers
- Dependence of Subthreshold Hump and Reverse Narrow Channel Effect on the Gate Length by Suppression of Transient Enhanced Diffusion at Trench Isolation Edge