Self-Alignment Process Using Liquid Resin for Assembly of Electronic or Optoelectronic Devices

概要

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We have developed a novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or optoelectronic devices. Though the liquid resins have a characteristics as low as one tenth of the surface tension of solder in general, restoring forces for self-alignment capability can be produced by making it constrained on the 3-dimensional pads on chip and substrate. In this paper, its principle and characteristics are described and the relationship between process parameters and joint geometry were examined. And the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. A self-alignment accuracy was examined experimentally and show that it became less than 0.4 μm. It can provide a useful information on various parameters involved in joint geometry and optimal design guideline to generate the proper profiles.
社団法人電子情報通信学会の論文
2001-12-01