Jung Seung-boo | Department Of Advanced Materials Engineering Sungkyunkwan University
スポンサーリンク
概要
関連著者
-
Jung Seung-boo
Department Of Advanced Materials Engineering Sungkyunkwan University
-
Jung Seung-boo
School Of Advanced Materials Science And Engineering Sungkyunkwan University
-
Jung S‐b
School Of Advanced Materials Science And Engineering Sungkyunkwan University
-
Jung Seung-boo
School Of Advanced Materials Sci. And Engineering Sungkyunkwan Univ.
-
Lee Chang-bae
Department Of Advanced Materials Engineering Sungkyunkwan University
-
LEE Won-Bae
Department of Advanced Materials Engineering, Sungkyunkwan University
-
Yoon Jeong-won
Department Of Advanced Materials Engineering Sungkyunkwan University
-
Lee Won-bae
Department Of Advanced Materials Engineering Sungkyunkwan University
-
YEON Yun-Mo
Department of Advanced Materials Application, Suwon Science College
-
Lee C‐b
Department Of Advanced Materials Engineering Sungkyunkwan University
-
Lee W‐b
Joining Research Group Technical Research Laboratories
-
YOON Jeong-Won
Department of Advanced Materials Engineering, Sungkyunkwan University
-
Shin Young-eui
Department Of Mechanical Engineering Chungang University
-
Yeon Yun-mo
Department Of Advanced Materials Application Suwon Science College
-
Shin Young-eui
Department Of Mechanical Engineering Chung-ang University
-
SHUR Chang-Chae
Department of Advanced Materials Engineering, Sungkyunkwan University
-
Kim Dae-gon
Department Of Advanced Materials Engineering Sungkyunkwan University
-
Shur Chang-chae
Department Of Advanced Materials Engineering Sungkyunkwan University
-
JUNG Jae
Department of Interaction Design. Graduate School of Techno Design. Kookmin University
-
Yoon J‐w
Department Of Advanced Materials Engineering Sungkyunkwan University
-
Shin Y‐e
Chung‐ang Univ. Seoul Kor
-
KIM Jong-Woong
Department of Advanced Materials Engineering, Sungkyunkwan University
-
YEON Yun-Mo
Suwon Science College, Hwasung
-
KIM Sang-Won
Department of Advanced Materials Engineering, Sungkyunkwan University
-
Kim Sang-won
Department Of Advanced Materials Engineering Sungkyunkwan University
-
Lee In-young
Department Of Advanced Materials Engineering Sungkyunkwan University
-
Jung Jae
Department Of Dermatology Behavioral Science Seoul National University College Of Medicine
-
Lee Kyung-woo
Department Of Mechanical Engineering Chung-ang University
-
Kim Jong-woong
Department Of Advanced Materials Engineering Sungkyunkwan University
-
Chang Kyong-ho
Department Of Civil And Environmental Engineering Chung-ang University
-
Jung Seung-boo
Department Of Metallurgical Engineering Sung Kyun Kwan University
-
Jung Jae
Department Of Biology Sunchon National University
-
Jung Seung‐boo
Department Of Advanced Materials Engineering Sungkyunkwan University
-
CHUN Hyun-Suk
Department of Advanced Materials Engineering, Sungkyunkwan University
-
Chun Hyun-suk
Department Of Advanced Materials Engineering Sungkyunkwan University
-
Lee Kwng-Woo
Department of Mechanical Engineering, Chung-Ang University
-
Kim Dae-Gon
Department of Advanced Materials Engineering, Sungkyunkwan University
著作論文
- Mechanical Properties Related to Microstructural Variation of 6061 Al Alloy Joints by Friction Stir Welding
- The Joint Characteristics of Friction Stir Welded AZ91D Magnesium Alloy
- IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
- Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder
- Effect of Surface Finishes on Ball Shear Strength in BGA Joints with Sn-3.5mass%Ag Solder
- Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy
- Interfacial Reactions Between Sn-58 mass% Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate
- Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis
- Effect of Microstructure on Mechanical Properties of Friction-Welded Joints between Ti and AISI 321 Stainless Steel
- Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
- Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging