Interfacial Reactions Between Sn-58 mass% Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate
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概要
- 論文の詳細を見る
- 2002-08-01
著者
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Jung Seung-boo
Department Of Advanced Materials Engineering Sungkyunkwan University
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Lee Chang-bae
Department Of Advanced Materials Engineering Sungkyunkwan University
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YOON Jeong-Won
Department of Advanced Materials Engineering, Sungkyunkwan University
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Yoon Jeong-won
Department Of Advanced Materials Engineering Sungkyunkwan University
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- Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder
- Effect of Surface Finishes on Ball Shear Strength in BGA Joints with Sn-3.5mass%Ag Solder
- Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy
- Interfacial Reactions Between Sn-58 mass% Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate
- Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis
- Effect of Microstructure on Mechanical Properties of Friction-Welded Joints between Ti and AISI 321 Stainless Steel
- Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
- Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging