Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy
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概要
- 論文の詳細を見る
- 2005-06-20
著者
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Jung Seung-boo
Department Of Advanced Materials Engineering Sungkyunkwan University
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Kim Dae-gon
Department Of Advanced Materials Engineering Sungkyunkwan University
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- Effect of Surface Finishes on Ball Shear Strength in BGA Joints with Sn-3.5mass%Ag Solder
- Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy
- Interfacial Reactions Between Sn-58 mass% Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate
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