Mechanical Properties Related to Microstructural Variation of 6061 Al Alloy Joints by Friction Stir Welding
スポンサーリンク
概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2004-05-20
著者
-
YEON Yun-Mo
Department of Advanced Materials Application, Suwon Science College
-
Jung Seung-boo
School Of Advanced Materials Science And Engineering Sungkyunkwan University
-
Jung S‐b
School Of Advanced Materials Science And Engineering Sungkyunkwan University
-
Jung Seung-boo
Department Of Advanced Materials Engineering Sungkyunkwan University
-
Jung Seung-boo
School Of Advanced Materials Sci. And Engineering Sungkyunkwan Univ.
-
Lee W‐b
Joining Research Group Technical Research Laboratories
-
LEE Won-Bae
Department of Advanced Materials Engineering, Sungkyunkwan University
-
Yeon Yun-mo
Department Of Advanced Materials Application Suwon Science College
-
Lee Won-bae
Department Of Advanced Materials Engineering Sungkyunkwan University
関連論文
- Microstructure and Mechanical Properties of Friction Stir Spot Welded Galvanized Steel
- Structure-Properties Relations in Friction Stir Spot Welded Low Carbon Steel Sheets for Light Weight Automobile Body
- Effect of Cr Thickness on Adhesion Strength of Cu/Cr/Polyimide Flexible Copper Clad Laminate Fabricated by Roll-to-Roll Process
- Effect of Pin Shapes on Joint Characteristics of Friction Stir Spot Welded AA5J32 Sheet
- Microstructures and Mechanical Properties of Double-Friction Stir Welded 2219 Al Alloy
- Mechanical Properties Related to Microstructural Variation of 6061 Al Alloy Joints by Friction Stir Welding
- The Joint Characteristics of Friction Stir Welded AZ91D Magnesium Alloy
- IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
- Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder
- Effect of Surface Finishes on Ball Shear Strength in BGA Joints with Sn-3.5mass%Ag Solder
- The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
- Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy
- Interfacial Reactions Between Sn-58 mass% Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate
- Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis
- Effect of Microstructure on Mechanical Properties of Friction-Welded Joints between Ti and AISI 321 Stainless Steel
- Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
- Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging
- Microstructures and Mechanical Properties of Friction Stir Welded 2.25Cr1Mo Steel
- Microstructures and Mechanical Properties of Friction Stir Welded 2.25Cr-1Mo Steel