Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method

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概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文
• 2005-11-20

著者

• Jung Seung-boo

  Department Of Advanced Materials Engineering Sungkyunkwan University

• Kim Dae-gon

  Department Of Advanced Materials Engineering Sungkyunkwan University

• Jung Seung‐boo

  Department Of Advanced Materials Engineering Sungkyunkwan University

• Kim Dae-Gon

  Department of Advanced Materials Engineering, Sungkyunkwan University

関連論文

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• The Joint Characteristics of Friction Stir Welded AZ91D Magnesium Alloy
• IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
• The Influence of the Machining and Assembling Errors on the Performance of the Shaft Supported by Active Magnetic Bearings
• Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder
• Effect of Surface Finishes on Ball Shear Strength in BGA Joints with Sn-3.5mass%Ag Solder
• Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy
• Interfacial Reactions Between Sn-58 mass% Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate
• Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis
• Effect of Microstructure on Mechanical Properties of Friction-Welded Joints between Ti and AISI 321 Stainless Steel
• Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
• Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging

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