JUNG Seung-Boo | School of Advanced Materials Science and Engineering, Sungkyunkwan University
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概要
- Jung Seung-Booの詳細を見る
- 同名の論文著者
- School of Advanced Materials Science and Engineering, Sungkyunkwan Universityの論文著者
関連著者
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JUNG Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jung Seung-boo
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Jung Seung-boo
School Of Advanced Materials Sci. And Engineering Sungkyunkwan Univ.
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CHOI Don-Hyun
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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LEE Chang-Yong
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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YEON Yun-Mo
Department of Advanced Materials Application, Suwon Science College
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Choi Don-hyun
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Lee Chang-yong
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Yeon Yun-mo
Department Of Advanced Materials Application Suwon Science College
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AHN Byung-Wook
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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SONG Keun
Department of Advanced Materials Application, Suwon Science College
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Jung Seung‐boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Ahn Byung-wook
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Song Keun
Department Of Advanced Materials Application Suwon Science College
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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BAEK Seung-Wook
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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LEE Chang-Yong
Automotive Applications Research Team, Technical Research Center, Hyundai Steel
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YOON Jeong-Won
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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Lee Jong-Gun
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Jung S‐b
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Baek Seung-wook
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Yoon Jeong-won
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Lee Jong-bum
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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NOH Bo-In
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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CHOI Jung-Hyun
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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HA Sang-Su
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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YANG Jun-Mo
National Nanofab Center, Measurement & Analysis
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Jung Seung-boo
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Ha Sang-su
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Yoon Jeong-won
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Lee C‐b
Department Of Advanced Materials Engineering Sungkyunkwan University
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Koo Ja-myeong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Shin Y‐e
Chung‐ang Univ. Seoul Kor
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Lee W‐b
Joining Research Group Technical Research Laboratories
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LEE Won-Bae
Joining Research Group, Technical Research Laboratories
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PARK Sun-Kyu
School of Civil and Environmental Engineering, Sungkyunkwan University
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Kim Kyung-sik
International Display Solution Co. Ltd.
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Nam Jae-do
School Of Applied Chemistry Sungkyunkwan University
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Yoon Jae-hyun
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Koh Min-Kwan
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Yang Jun-mo
National Nanofab Center Measurement & Analysis
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Yang Jun-mo
National Nanofab Center
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Koh Min-kwan
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Shin Young-eui
Department Of Mechanical Engineering Chungang University
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Choi Jung-hyun
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Shin Young-eui
Department Of Mechanical Engineering Chung-ang University
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Noh Bo-in
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Park Sun-kyu
School Of Civil And Environmental Engineering Sungkyunkwan University
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Kim Jong-woong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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SHUR Chang-Chae
Department of Advanced Materials Engineering, Sungkyunkwan University
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LEE Chang-Bae
School of Metallurgical and Materials Engineering, SungKyunKwan University
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SHUR Chang-Chae
School of Metallurgical and Materials Engineering, SungKyunKwan University
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KIM Dae-Gon
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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CHOI Sunglak
AMLCD Division, Samsung Electronics Co., Ltd.
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LEE Hoo-Jeong
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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JOO Jinho
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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Joo Jinho
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Kim Dae-gon
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Choi Sunglak
Amlcd Division Samsung Electronics Co. Ltd.
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Lee Hoo-jeong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Lee Hoo-jeong
School Of Advanced Material Science Sungkyunkwan University
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Shur Chang-chae
Department Of Advanced Materials Engineering Sungkyunkwan University
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Park Sun-kyu
School Of Civil And Environmental Engineering Sungkyunkwan Univ.
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Jung Seung‐boo
School Of Advanced Materials Science & Engineering Sungkyunkwan University
著作論文
- 2P4-2 超音波によるプリント基板接合における機械特性への表面仕上げの影響(ポスターセッション)
- Microstructure and Mechanical Properties of Friction Stir Spot Welded Galvanized Steel
- Structure-Properties Relations in Friction Stir Spot Welded Low Carbon Steel Sheets for Light Weight Automobile Body
- Effect of Cr Thickness on Adhesion Strength of Cu/Cr/Polyimide Flexible Copper Clad Laminate Fabricated by Roll-to-Roll Process
- Effect of Pin Shapes on Joint Characteristics of Friction Stir Spot Welded AA5J32 Sheet
- Electromigration Behavior of through-Si-via (TSV) Interconnect for 3-D Flip Chip Packaging
- 1Pb-49 超音波接合されたフリップチップパッケージにおける非鉛エポキシソルダの熱特性(ポスターセッション)
- Microstructures and Mechanical Properties of Double-Friction Stir Welded 2219 Al Alloy
- The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
- Characterization of Failure Behaviors in Anisotropic Conductive Interconnection